TM Gipsavjämning can be used in both structures with adhesion to the surface and in floating structures where there is no adhesion to the underlying material. The product must always be coated.

* Take into account risk of sag. The product is intended for application to an inelastic substrate. The thickness of chipboard must be at least 22 mm. If the spacing of joists is greater than cc300, the levelling compound's height of pour must be at least 12 mm.

** See our substrate guide at www.tmprogress.se

TM Gipsavjämning is intended to be coated with a surface layer. See our surface layer guide at www.tmprogress.se

The temperature is extremely important for successful results. 10°C for the substrate, the material and the indoor temperature is the minimum level defined in AMA Hus 11. The temperature of the floor structure should be checked in good time before priming. A higher temperature is very beneficial in terms of both quality and drying time

If the slope and curvature of the substrate deviates from the prescribed tolerance, the floor should be levelled using a spirit level or laser. Setting out height-adjusted level pins will allow you to ensure when laying the levelling compound that the layer thickness is sufficient to meet the tolerances..

Pour or pump out the ready-mixed levelling compound in widths on the substrate. Lay each new width right next to an old width as soon as possible so that the compound flows together to form a flat, even coating/surface. Make the widths no more than about 10 metres wide by using TM side form strips. Work the levelling compound using a notched trowel or spiked roller in order to achieve maximum smoothness

The drying time of the levelling compound is affected by the layer thickness, the temperature of the floor structure and air and the relative humidity on the premises. Good ventilation on the premises is a prerequisite for effective drying. TM Gipsavjämning is normal-drying and the guideline value for drying time is 24 hours/mm at 20°C, 50% RF and with good air circulation. Levelling layers thicker than 40 mm, drying on one side, lower temperature or higher humidity will prolong the drying time. The product can be laid on concrete with up to 95% RF but note that the levelling compound can never be drier than the substrate. Note that the levelling compound is unable to withstand shrinkage movements or settling from the drying of the substrate. To prevent excessively fast drying and a risk of cracking, the applied levelling compound must not be exposed to draughts, high temperature or direct sunlight.